ZD-11P Aluminum Base 3X OD90MM Magnifying Glass Handheld Auxiliary Lens Attachment - Magnifier
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Notify me when its in stockZD-11P Aluminum Base 3X OD90MM Magnifying Glass Attachment
The ZD-11P Aluminum Base 3X OD90MM Magnifying Glass Attachment is a professional optical upgrade engineered for micro-electronics rework, fine pitch soldering, and detailed component inspection tasks. Outfitted with a threaded baseline mount, it integrates seamlessly into the modular channels of the ZD-11P aluminum workstation series within seconds.
Featuring a widened **90 mm outer diameter (OD90MM)** optical-grade lens, it delivers a crystal-clear **3X magnification** factor. The expansive field-of-view allows technicians to trace hairline PCB fractures, read miniature SMD package codes, and execute micro-pin soldering without inducing eye strain. The heavy-duty flexible gooseneck arm holds the lens firmly at your designated spatial focal point.
Key Features:
- 3X High-Fidelity Magnification: Premium optical-grade lens that eliminates distortion, clarifying micro pad fields and SMD part markers cleanly.
- OD90MM Wide Field of View: Generous 9 cm viewport diameter that minimizes the need to constantly reposition the lens during tracing work.
- Sag-Free Flexible Arm: High-tension gooseneck core designed to lock the weight of the heavy optical shroud in place without drifting.
- Threaded Machine Fitment: Anchors directly into the pre-machined slots of ZD-11P aluminum baseplates to guarantee a vibration-free viewing stance.
Technical Specifications:
| Parameter | Value |
| Model / Series | ZD-11P Magnifier Expansion Unit |
| Optical Magnification | 3X Distortion-Free Tracking |
| Lens Outer Diameter (OD) | 90 mm (OD90MM) |
| Arm Class | High-Tension Metal Composite Gooseneck Arm |
| Base Compatibility | ZD-11P Heavy-Duty Aluminum Base Ecosystem |
Application Areas:
- Soldering and validating 0402, 0603 size surface-mount chips, multi-pin IC leads, and micro traces.
- Horology watch repair, miniature jewelry processing, delicate scale modeling, and micro-scale laboratory analysis.
- Spotting cold-solder joint fractures and micro copper trace bridges on densely packed circuit board assemblies.