Kurtel Sn99.3-Cu0.7 Lead Free Solder Bar

Kurtel Sn99.3-Cu0.7 Lead Free Solder Bar

Kurtel Sn99.3-Cu0.7 Lead Free Solder Bar is a eutectic alloy specifically developed for lead-free soldering applications. It is suitable for wave, selective, and dip soldering processes. Compliant with RoHS II (2011/65/EU), this solder bar enables environmentally friendly production while offering cost advantages thanks to its silver-free composition and excellent wetting performance for strong and reliable solder joints.

With a eutectic melting point of 227°C, the Sn99.3-Cu0.7 alloy ensures a stable soldering process and homogeneous joint structure. It is an ideal solution for industrial production lines and professional electronic assembly applications requiring consistent quality and performance.

Kurtel Sn99.3-Cu0.7 Lead Free Solder Bar Technical Specifications:

• Alloy Composition: Sn 99.3% (±0.15) / Cu 0.7% (±0.15)

• Melting Point: 227°C (Eutectic)

• Specific Gravity: 7.3 g/cm³

• Application Methods: Wave, selective, and dip soldering

• RoHS II (2011/65/EU) compliant lead-free alloy

• Product Form: Trapezoidal ingot, approximately 0.92 kg each, supplied in 20 kg boxes

• Storage Conditions: Store in a dry place at room temperature

• Shelf Life: Indefinite under proper storage conditions

Useful Links / Documents:

• Technical Data Sheet

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